Composite Bonding Films
Hysol® EA 9695™
Low-flow composite bonding film, excellent environmental resistance. Composite structure repair, cure and co-cure with composite laminates. Qualified to Airbus. Data from .050 psf, 250 g/m2.
>300°F/149°C service temperature.
Epoxy film adhesive designed for composite bonding applications. May cure at 250°F/121°C or 350°F/177°C, with service temperatures up to 350°F/177°C. Ideal for co-cure or secondary bonding applications. Outstanding handling characteristics. Superior elevated temperature performance at 270°F/132°C. Excellent outtime. Exceeds requirements of BMS 5-154. Can be used for both surfacing film and lightning strike applications.
Tougher version of PL 795™. Excellent flow characteristics. Excellent tack and handling characteristics. Improved elevated temperature performance. Can be used for both surfacing film and lightning strike applications.
350°F/177°C service temperature.
Epoxy film adhesive formulated to provide excellent performance properties in composite bonding, and has excellent results on composite surfaces that have been exposed to bond shop environments and may have absorbed moisture. Excellent fracture toughness (G 1C) over composite surfaces exhibiting cohesive failure patterns, indication superior adhesion characteristics. Qualified at Boeing.
300°F/149°C service temperature.