Core Splices

Hysol® EA 9833.1(BMI)™
Modified BMI foaming core splice, co-curable with wide variety of 350°F/177°C curing epoxy prepregs. Elevated service temperature to 450°F/232°C. Tube shear 800 psi @77°F/5.5 Mpa @ 25°C, 500 psi @ 250°F/3.5 Mpa @ 121°C.

MA 557™
Modified epoxy foaming adhesive that may be cured at 250°F/121°C or 350°F/177°C Designed to seal, splice or reinforce honeycomb materials. Excellent slump resistance, medium tack, non-metallic.

MA 562™
General purpose 250°F/121°C or 350°F/177°C curing foaming adhesive. Designed for service temperatures from -67°F/-55°C to 350°F/177°C. Medium tack, non-metallic, low exotherm properties, excellent slump resistance, uniform expansion, qualified to many industry specifications.

MA 562S™
Modified epoxy foaming adhesive that may be cured at 250°F/121°C or 350°F/177°C.  Non-metallic, medium tack, excellent slump resistance. 

MA 562SFR™
Modified epoxy foaming adhesive that may be cured at 250°F/121°C or 350°F/177°C. Flame-retardant, non-metallic, medium tack, excellent slump resistance.

PL 460™
Foaming epoxy adhesive in paste form for easy extrusion through packaged cartridges. Expands and cures at temperatures from 250°F/121°C to 350°F/177°C. Qualified to Boeing BMS 5-90, Type IV.

SynSpand® 9899CF™
Closed cell expanding syntactic film for use in a designed medium density/strength range of 18-35 pounds per cubic foot (0.29-0.56 g/cc). Ideal for core filling and edge close-out.
350°F/177°C service temperature.