Tough High Strain Pastes

Hysol^® EA 9309.3NA™
Toughened adhesive with excellent peel strength. Contains glass beads for bondline control.
180°F/82°C service temperature.

Hysol^® EA 9313™
Very low viscosity adhesive yielding tough, flexible bonds. Injectable.
120°F/49°C service temperature.

Hysol^®EA 9320NA™
High shear and high peel adhesive system with room temperature cure.
>180°F/82°C service temperature.

Hysol^® EA 9330™
Easy mix adhesive with high peel strength and excellent environmental durability.
180°F/82°C service temperature.

Hysol^® EA 9330.3™
Non-slump thixotropic adhesive with high peel strength and excellent environmental durability.
180°F/82°C service temperature.

Hysol^® EA 9346.5™
Moderate viscosity, one component, high peel and shear strength. Outstanding hot/wet properties. Recommended
replacement for Hysol® EA 9304.1™, Hysol® EA 9304.2™.
275°F/135°C service temperature.

Hysol^® EA 9359.3™
Excellent peel and shear strength. Bonds a variety of substrates. Volumetric mix ratio 2:1. Improvement over Hysol® EA 9309NA™ series adhesives.
200°F/93°C service temperature.

Hysol^® EA 9360™
Volumetric mix ratio 2:1. Structural adhesive, exhibits excellent peel strength and tensile lap shear strength to 250°F/121°C.
>225°F/107°C service temperature.

Hysol^® EA 9371™
Fast-set, tough, good hot/wet properties. Handling strength after two hours. Volumetric mix ratio 1:1.
180°F/82°C service temperature.

Hysol^® EA 9380™
Cures at low temperature. Offers strength, toughness and high temperature resistance of heat-curing film adhesives, with greater flexibility and ease of use. Can be applied to large parts with controlled meter mix operation.
250°F/121°C service temperature.